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カテゴリおよび A ～ Z で参照するか、チャットでメーカーについて質問してください。従来のカタログではなく、代替品、供給コンテキスト、および BOM 対応分析のためのインテリジェンス ハブ。
- STMicroelectronics
Major supplier of MCUs, power discretes, MEMS, and automotive-grade ICs with deep ecosystem tooling.
- Texas Instruments
Broad analog and embedded portfolio with strong reference designs and long lifecycle parts.
- Analog Devices
Precision measurement, RF, and power management ICs for industrial and automotive designs.
- Infineon
Power semiconductors, automotive MCUs, and security ICs for high-reliability systems.
- NXP Semiconductors
Automotive and industrial connectivity MCUs with strong secure element and radar portfolios.
- Microchip Technology
8/16/32-bit MCUs, analog, and connectivity with broad legacy part support.
- onsemi
Power and sensing solutions for automotive, industrial, and energy infrastructure.
- GigaDevice
GD32 and memory lines often evaluated as pin-compatible or cost-down paths for ST/TI designs.
- Renesas Electronics
Automotive and industrial MCUs with strong reference platforms and long-term supply programs.
- ROHM Semiconductor
Power discretes, LED drivers, and sensor ICs for consumer and industrial power paths.
- Vishay Intertechnology
Discrete semiconductors, passives, and optoelectronics for harsh-environment designs.
- Maxim Integrated
Now part of ADI lineage — still referenced in legacy BOMs for power and interface ICs.
- Linear Technology
High-performance power and data conversion parts retained under the ADI portfolio.
- Silicon Labs
Low-power wireless MCUs and timing/isolation ICs for IoT and industrial edge nodes.
- Espressif Systems
ESP32/ESP8266 families dominate connected MCU BOMs with strong open-source ecosystems.
- Qualcomm
Wireless connectivity and compute platforms for mobile, IoT, and edge applications.
- Broadcom
Networking, storage, and optical connectivity components for infrastructure designs.
- Murata
Ceramic capacitors, RF modules, and sensing modules common in compact consumer hardware.
- TDK
Magnetics, passives, and sensor modules widely used in power and motion systems.
- Samsung Electro-Mechanics
MLCC and module products frequently specified in mobile and compact electronics BOMs.
- Yageo
High-volume passives supplier for cost-sensitive consumer and industrial designs.
- Würth Elektronik
Passives and interconnect products with strong availability for European supply chains.
- TE Connectivity
Industrial connectors and sensor products for automotive and harsh-environment assemblies.
- Molex
Connector and cable solutions for datacom, consumer, and automotive harness designs.
- Amphenol
Rugged interconnect products for aerospace, industrial, and datacenter applications.
- Bosch Sensortec
MEMS inertial and environmental sensors common in wearables and mobile platforms.
- ams OSRAM
Optical sensing and illumination components for consumer and automotive lighting.
- Melexis
Automotive magnetic and infrared sensing ICs with LIN/CAN interface integration.
- Monolithic Power Systems
Integrated power converters and motor drivers for compact, high-efficiency power stages.
- Power Integrations
Offline power conversion ICs and gate drivers for adapter and industrial power supplies.
- Diodes Incorporated
Discrete, logic, and power products often used as second-source paths in cost-down BOMs.
- Littelfuse
Circuit protection and power control products for safety-critical power paths.
- 3M
Interconnect and EMC materials referenced in assembly and shielding BOM lines.
- AMD Xilinx
FPGA and adaptive SoC platforms for acceleration and interface bridging designs.
- Intel
FPGA, embedded, and connectivity portfolios inherited from Altera and mobile lines.
- Lattice Semiconductor
Small-form-factor FPGAs for bridging, control, and low-latency interface aggregation.
