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XDZ200C-1-03-Z-2.8-G1 AI Analysis:
Specs, Applications & Alternatives

AI summary

XDZ200C-1-03-Z-2.8-G1 product

XDZ200C-1-03-Z-2.8-G1

Interconnects

Header2.00mm PitchThrough-Hole

The XDZ200C-1-03-Z-2.8-G1 is a 3-position, 2.00mm pitch single-row round pin header designed for straight through-hole PCB mounting.

Best for

  • PCB-to-PCB or wire-to-board connections
  • General purpose electronic prototyping

Avoid if

  • High-vibration environments requiring locking mechanisms
  • Applications requiring surface mount (SMT) technology

Check before use

  • PCB footprint compatibility
  • Soldering temperature profile

Key specifications

Pitch
2.00 mm
Positions
3
Current Rating
2.0 A

Compliance & Environment

RoHS
-
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

General Interconnects

Datasheet

f28a35931d8fcd8daebc8949fed3020e_2310311431_chxunda-XDZ200C-1-03-Z-2-8-G1_C19184373.pdf

800 KB

Datasheet AI

CAD Models

EDA symbol, PCB footprint, and 3D model for this component. Supported tools include Altium, KiCad, Eagle, and more.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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Login required · CAD models billed separately as an add-on

Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a 3-pin, 2.00mm pitch male header connector with round pins, intended for vertical through-hole soldering.