
Milliohm
Functionally similar with higher power, but in a larger 2512 package requiring board redesign.
Finding a substitute for the HoLRT1206-1W-300mR-1% requires matching its 1206 package, 1W power, and 0.3Ω 1% precision. Alternatives may differ, requiring review.
Candidates have different resistance or TCR values.
One candidate has a different package, requiring board redesign.
No direct, pin-compatible replacement has been identified. All candidates have significant differences in package or electrical parameters.
No direct drop-in found. HoYH1206-1W-330mR-1% is same package but different specs. HoYLR2512-3W-300mR-1% is electrically better but needs a new PCB layout.
The primary risks are package mismatch requiring board redesign, or parametric deviations (resistance, TCR) impacting circuit performance.

Milliohm
Functionally similar with higher power, but in a larger 2512 package requiring board redesign.
| Feature / factor | HoLRT1206-1W-300mR-1% | HoYLR2512-3W-300mR-1% | HoYH1206-1W-330mR-1% | Alt 3 | Compatibility / risk |
|---|---|---|---|---|---|
| Package | 1206 | 2512 | 1206 | 2512 / 1206 — Requires PCB layout change.; HoYH1206-1W-330mR-1%: Package size matches. | |
| Power | 1.0W | 3.0W | 1.0W | 3.0W / 1.0W — Higher power rating provides more margin.; HoYH1206-1W-330mR-1%: No power margin over target. | |
| Resistance | 0.3Ω | 0.3Ω | 0.33Ω | 0.3Ω / 0.33Ω — Resistance value matches.; HoYH1206-1W-330mR-1%: 10% higher resistance, may affect accuracy. | |
| Tolerance | ±1% | ±1% | - | ±1% — Tolerance matches. | |
| Tcr | ±50ppm/℃ | ±50ppm/℃ | ≤100ppm/°C | ±50ppm/℃ / ≤100ppm/°C — Temperature coefficient matches.; HoYH1206-1W-330mR-1%: Worse temperature stability. | |
| Technology | Alloy Thin Film | - | Ceramic Alloy | Ceramic Alloy — Different technology may affect secondary characteristics. |
There is no single best alternative. For electrical performance, HoYLR2512-3W-300mR-1% is strong but needs a board change. For form-factor, HoYH1206-1W-330mR-1% fits but has different electrical values.