
MDD(Microdiode Semiconductor)
Functional alternative with matching recovery time but higher forward voltage, requiring thermal review.
MURS360BT3G is a 600V, 3A ultrafast rectifier in an SMB package. Finding a replacement requires matching its 75ns recovery time while carefully managing the thermal impact of forward voltage.
Higher VF in alternatives will increase power loss and component temperature, risking thermal runaway.
Viable candidates share the same SMB package, ensuring mechanical compatibility.
No direct, drop-in replacement was found without caveats. Potential alternatives have a higher forward voltage, which is a critical difference that requires engineering validation.
Prioritize candidates with trr ≤ 75ns and VF ≤ 1.25V. While parts like US3MB match on speed, their higher forward voltage increases power loss, requiring a mandatory thermal review.
The main risk is increased power dissipation and heat due to higher forward voltage (VF) in potential alternatives, which can lead to component failure.

MDD(Microdiode Semiconductor)
Functional alternative with matching recovery time but higher forward voltage, requiring thermal review.
| Feature / factor | MURS360BT3G | US3MB | ES5JB | Alt 3 | Compatibility / risk |
|---|---|---|---|---|---|
| Package | SMB (DO-214AA) | SMB | SMB | SMB — Form-factor compatible.; ES5JB: Form-factor compatible. | |
| Voltage | 600V | 1000V | 600V | 1000V / 600V — Higher VRRM provides more margin.; ES5JB: VRRM matches. | |
| Current | 3A | 3A | 5A | 3A / 5A — Current rating matches.; ES5JB: Higher current rating provides more margin. | |
| Recovery Time | 75ns | 75ns | 35ns | 75ns / 35ns — Recovery time matches.; ES5JB: Faster recovery time is generally acceptable. | |
| Forward Voltage | 1.25V | 1.68V | 1.7V | 1.68V / 1.7V — Significantly higher VF increases power loss.; ES5JB: Significantly higher VF increases power loss. |
No perfect drop-in is available. US3MB matches the recovery time and ES5JB is faster, but both have a higher forward voltage, which increases heat. A thermal design review is essential before substitution.