
Sunlord
A functional alternative with higher current ratings but a larger physical footprint requiring board redesign.
Find and compare alternatives for the TDK SLF7045T-470MR75-PF, a 47µH power inductor. This analysis covers functional replacements, highlighting key differences in current ratings, DCR, and package size.
All suitable electrical alternatives are physically larger and not drop-in compatible.
Candidates offer superior current handling and lower DCR, posing minimal electrical risk.
No direct, drop-in replacement was identified. All candidates with matching inductance have different physical packages, requiring a PCB layout change.
Functional upgrade requiring board redesign.
Package mismatch requiring PCB redesign.

Sunlord
A functional alternative with higher current ratings but a larger physical footprint requiring board redesign.
| Feature / factor | SLF7045T-470MR75-PF | SWPA8040S470MT | FCH1050-470M | FCH1365-470M | Compatibility / risk |
|---|---|---|---|---|---|
| Inductance | 47 µH | 47 µH | 47 µH | 47 µH | 47 µH — Inductance matches target.; FCH1050-470M: Inductance matches target.; FCH1365-470M: Inductance matches target.; PSPHAQ127-470M: Inductance matches target. |
| Saturation Current | 0.75 A | 1.75 A | 5.2 A | 7.0 A | 1.75 A / 5.2 A / 7.0 A / 3.2 A — Significantly higher current rating.; FCH1050-470M: Massively higher current rating.; FCH1365-470M: Massively higher current rating.; PSPHAQ127-470M: Significantly higher current rating. |
| Dcr | 0.125 Ω | 0.113 Ω | - | - | 0.113 Ω — Lower DCR is generally better. |
| Package | 7045 (7x7mm) | 8040 (8x8mm) | 11.5x10.5mm | 1365 | 8040 (8x8mm) / 11.5x10.5mm / 1365 / 12x12mm — Larger package, not a drop-in replacement.; FCH1050-470M: Much larger package, not a drop-in replacement.; FCH1365-470M: Much larger package, not a drop-in replacement.; PSPHAQ127-470M: Much larger package, not a drop-in replacement. |
No direct drop-in replacement was found. The best alternatives, like Sunlord's SWPA8040S470MT, offer better electrical performance but require a board redesign due to a larger package.