
Cross-vendor alternative from TDK with identical inductance, superior current handling and DCR, but requires a different PCB footprint.
SM4532-4R7MT is a 4.7µH unshielded power inductor in a 4532 package, common in DC-DC converters. While no direct drop-in replacements were found, alternatives exist with better performance but require PCB layout changes.
Suitable alternatives offer superior current and DCR ratings.
All strong electrical alternatives require a PCB layout change.
No direct drop-in replacement was identified. All potential candidates have different package footprints, requiring a PCB layout change.
For new designs or board revisions, consider TDK's SPM6530T-4R7M-HZR for its superior electrical performance and shielding. No direct drop-in replacement was found.
The primary risk is the package mismatch. No candidates share the exact 4532 footprint of the target part, which prevents a drop-in replacement.

Cross-vendor alternative from TDK with identical inductance, superior current handling and DCR, but requires a different PCB footprint.
| Feature / factor | SM4532-4R7MT | SPM6530T-4R7M-HZR | SM7850-4R7MT | Alt 3 | Compatibility / risk |
|---|---|---|---|---|---|
| Package | 4532 | SPM6530 | SM7850 | SPM6530 / SM7850 — Different footprint, requires layout change.; SM7850-4R7MT: Larger footprint, requires layout change. | |
| Manufacturer Name | SXN | TDK | - | TDK — Cross-vendor alternative. | |
| Inductance | 4.7 µH | 4.7 µH | - | 4.7 µH — matched | |
| Saturation Current A | 2.0 A | 6.2 A | 5.0 A | 6.2 A / 5.0 A — Significantly higher current handling.; SM7850-4R7MT: Significantly higher current handling. | |
| Dcr Ohm | 0.08 Ω | 0.039 Ω | 0.026 Ω | 0.039 Ω / 0.026 Ω — Lower resistance improves efficiency.; SM7850-4R7MT: Lower resistance improves efficiency. | |
| Shielding | Unshielded | Shielded | - | Shielded — Improves EMI performance. | |
| Inductance H | 4.7e-06 H | - | 4.7e-06 H | 4.7e-06 H — matched |
SPM6530T-4R7M-HZR from TDK offers significantly better current ratings and lower resistance in a shielded package. However, it has a different footprint and requires a board redesign.