
BXCONN
Strong form, fit, and electrical match. Requires datasheet review to confirm PCB footprint.
ZX-PH2.0-WT6P is a 6-pin, 2.0mm pitch, right-angle SMT header from Megastar. Key considerations for replacement are matching the SMT footprint, mechanical dimensions, and right-angle orientation.
SMT footprint and housing dimensions must be verified to ensure correct assembly and mating.
Voltage and current ratings are standard and easily matched by several alternatives.
No confirmed direct drop-in replacement exists. WF-1F200A6P is a strong functional match but requires footprint verification from its datasheet.
Cross-reference to other manufacturers' 2.0mm pitch, 6-pin right-angle SMT headers like BXCONN's WF-1F200A6P.
Mechanical footprint mismatch.

BXCONN
Strong form, fit, and electrical match. Requires datasheet review to confirm PCB footprint.
| Feature / factor | ZX-PH2.0-WT6P | WF-1F200A6P | WAFER-HY2.0-6PWB | Alt 3 | Compatibility / risk |
|---|---|---|---|---|---|
| Package | 6-pin SMT Header | 6-pin SMT Header | SMT | 6-pin SMT Header — Package name matches, but full mechanical drawing verification is required.; WAFER-HY2.0-6PWB: Package type matches, but full mechanical drawing verification is required. | |
| Pitch | 2.0mm | 2.0mm | 2.0mm | 2.0mm — matched; WAFER-HY2.0-6PWB: matched | |
| Mounting | Right Angle SMT | Right Angle SMT | Right Angle SMT | Right Angle SMT — matched; WAFER-HY2.0-6PWB: matched | |
| Voltage | 250V | 250V | 250V | 250V — matched; WAFER-HY2.0-6PWB: matched | |
| Current | 2.0A | 2.0A | 2.0A | 2.0A — matched; WAFER-HY2.0-6PWB: matched |
WF-1F200A6P by BXCONN is a strong candidate, matching key electrical and mechanical specifications. However, datasheet verification of the PCB footprint is essential before procurement.