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1241050-3 AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

1241050-3 product

1241050-3

Interconnects

AMPMODUHeader2.54mm

The 1241050-3 is a 6-position, 2-row vertical AMPMODU header designed for board-to-board signal applications with a 2.54 mm pitch.

Best for

  • Board-to-board signal connections

Avoid if

  • Through-hole mounting is required

Check before use

  • PCB footprint and solder reflow profile

Key specifications

Positions
6
Pitch
2.54 mm
Mounting
Surface Mount
Current Rating
5 A

Compliance & Environment

RoHS
Compliant
REACH
Does not contain REACH SVHC
MSL
-
ECCN
-
HTSUS
-

Application

Signal

Datasheet

TE-Connectivity---AMP-1241050-3.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for 1241050-3: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Where to Buy

Real-time and catalog pricing from verified distributors

Live prices updated on demand · Catalog (~) prices may differ

Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a 6-position vertical PCB mount header from TE Connectivity's AMPMODU series, featuring gold-plated contacts and surface mount termination.