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1735801-1 AI Analysis:
Specs, Applications & Alternatives

AI summary

1735801-1 product

1735801-1

Interconnects

HPICrimp Contact2.0mm Pitch

The 1735801-1 is a 2.0mm pitch HPI crimp contact by TE Connectivity, suitable for wire-to-board connections using AWG #30 to #24 wires.

Best for

  • Wire-to-board signal connections

Avoid if

  • High-power applications exceeding contact ratings

Check before use

  • Ensure correct crimp tool is available for the wire gauge used.

Key specifications

Pitch
2.0 mm
Wire Range
AWG #30-#24
Material
Phosphor Bronze

Compliance & Environment

RoHS
-
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

Wire-to-Board

Datasheet

d758afcc72de50703889d5b7baa11eb8.pdf

800 KB

Datasheet AI

CAD Models

EDA symbol, PCB footprint, and 3D model for this component. Supported tools include Altium, KiCad, Eagle, and more.

EDA Symbol
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a 2.0mm pitch HPI crimp contact designed for wire-to-board interconnect systems.