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2170088-2 AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

2170088-2 product

2170088-2

Interconnects

zSFP+High-SpeedTE Connectivity

The 2170088-2 is a 20-pin zSFP+ surface-mount connector from TE Connectivity, optimized for high-speed data rates up to 56 Gbps PAM-4.

Best for

  • Data center switches
  • Telecommunications infrastructure

Avoid if

  • Low-speed legacy applications where cost is the primary driver

Check before use

  • PCB footprint compatibility
  • Cage assembly requirements

Key specifications

Data Rate
Up to 56 Gbps PAM-4
Plating
15µ" Gold
Mounting
Surface Mount
Operating Temp
-40°C to +85°C

Compliance & Environment

RoHS
Compliant
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

NetworkingData Center

Datasheet

PCON-S-A0007223422-1.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for 2170088-2: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Where to Buy

Real-time and catalog pricing from verified distributors

Live prices updated on demand · Catalog (~) prices may differ

Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a 20-pin zSFP+ pluggable I/O connector designed for high-speed networking and data center applications.