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4.0MM*200MM*400MM2.0W AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

4.0MM*200MM*400MM2.0W product

4.0MM*200MM*400MM2.0W

Component

thermal interfacesilicone padelectrical insulation2.0 W/m-K

Karefonte PM200 is a 4.0 mm thermal silicone pad specified at 2.0 W/m-K for electrically insulated heat transfer across component-to-heatsink gaps.

Best for

  • Electrically insulated thermal interfaces
  • Gap filling between electronic components and heat sinks
  • Power, lighting, and communication hardware

Avoid if

  • A very thin interface or high-performance phase-change material is required
  • A documented compliance or lifecycle statement is mandatory but unavailable

Check before use

  • Installed thickness and compression
  • Dielectric withstand at the selected thickness
  • Surface flatness and contact pressure
  • Adhesive or tack requirements

Key specifications

Thermal conductivity
2.0 W/m-K
Thickness
4.0 mm
Sheet dimensions
200 mm × 400 mm
Operating temperature
-58 to 200 °C

Compliance & Environment

RoHS
-
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

Power suppliesLED lightingCommunication equipment

Datasheet

C5439032.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for 4.0MM*200MM*400MM2.0W: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a Karefonte PM200 thermal silicone sheet with a specified thickness of 4.0 mm, sheet dimensions of 200 mm × 400 mm, and thermal conductivity of 2.0 W/m-K.