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440129-5 AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

440129-5 product

440129-5

Interconnects

2.0mm PitchCrimp HousingTE Connectivity

The 440129-5 is a 5-position, 2.0mm pitch HPI crimp housing from TE Connectivity, designed for secure wire-to-board connections.

Best for

  • Wire-to-board connectivity
  • Compact electronic assemblies

Avoid if

  • High-vibration environments without strain relief

Check before use

  • Terminal part numbers
  • Wire gauge compatibility

Key specifications

Pitch
2.0 mm
Positions
5
Material
Thermoplastic (UL94V-0)

Compliance & Environment

RoHS
Compliant
REACH
Unknown
MSL
-
ECCN
EAR99
HTSUS
8536.90.4000

Application

General PurposeIndustrial

Datasheet

CAD Models

Download ECAD models for 440129-5: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Where to Buy

Real-time and catalog pricing from verified distributors

Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a 5-position, 2.0mm pitch crimp housing from the TE Connectivity HPI series, used for wire-to-board interconnects.