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440133-3 AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

440133-3 product

440133-3

Rectangular Connectors - Housings

ConnectorHousing2.5mm Pitch

The 440133-3 is a 3-position, 2.5mm pitch HPI crimp housing from TE Connectivity, designed for wire-to-board and wire-to-wire connections.

Best for

  • General wire-to-board interconnects
  • Low-profile signal applications

Avoid if

  • High-vibration environments requiring positive locking

Check before use

  • Terminal compatibility
  • Wire gauge limits

Key specifications

Positions
3
Pitch
2.5 mm
Material
Nylon 66
Temp Range
-25°C to +105°C

Compliance & Environment

RoHS
Compliant
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

General Interconnect

Datasheet

440133-3

800 KB

Datasheet AI

CAD Models

Download ECAD models for 440133-3: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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Where to Buy

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Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a 3-position HPI (High Performance Interconnect) crimp housing with a 2.5mm pitch, manufactured by TE Connectivity.