450-3326-01-03-00 AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

450-3326-01-03-00 product

450-3326-01-03-00

Terminals

solder mount socketpin receptacle0.060 in to 0.062 in pinsgold over nickelberyllium copper spring

450-3326-01-03-00 is a gold-over-nickel solder-mount socket intended for 0.060 in to 0.062 in diameter pins.

Best for

  • Board-mounted connection to 1.52 mm to 1.57 mm round pins
  • Applications requiring a soldered receptacle contact

Avoid if

  • The mating pin is outside the specified 0.060 in to 0.062 in diameter range
  • Documented electrical or compliance ratings are required before design release

Check before use

  • Mounting-hole diameter and depth
  • Pin diameter
  • Required electrical ratings
  • RoHS and lifecycle status

Key specifications

Compatible pin diameter
0.060 in to 0.062 in (1.52 mm to 1.57 mm)
Recommended mounting hole
0.102 in ±0.002 in (2.59 mm ±0.05 mm)
Minimum hole depth
0.200 in (5.08 mm)
Finish -03
Body: 0.25 µm gold over nickel; spring: 0.75 µm gold over nickel

Compliance & Environment

RoHS
RoHS Compliant

Application

Board-mounted pin receptaclesGeneral electronic interconnects

CAD Models

Download ECAD models for 450-3326-01-03-00: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
Get Files
PCB Footprint
Land pattern for PCB layout
Get Files
3D Model
STEP file for mechanical design
Get Files
KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
Generate library

Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a Cambion solder-mount socket for receiving round pins with diameters from 0.060 in to 0.062 in (1.52 mm to 1.57 mm).