ProjectsPricingInsights

A2008WV-2X9P AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

A2008WV-2X9P product

A2008WV-2X9P

Interconnects

2.00mm PitchDual RowVertical Header

The CJT A2008WV-2X9P is a 2.00mm pitch, 18-pin dual-row vertical male header designed for wire-to-board applications.

Best for

  • Wire-to-board connections
  • Compact PCB designs

Avoid if

  • High-vibration environments without strain relief
  • Applications requiring high-current (>3A)

Check before use

  • Mating housing compatibility
  • PCB footprint

Key specifications

Pitch
2.00 mm
Positions
18 (2x9)
Current Rating
3 A

Compliance & Environment

RoHS
Compliant
REACH
Compliant
MSL
-
ECCN
-
HTSUS
-

Application

General ElectronicsIndustrial

Datasheet

891974a99965a085b7e2d3441f567ca4.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for A2008WV-2X9P: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
Get Files
PCB Footprint
Land pattern for PCB layout
Get Files
3D Model
STEP file for mechanical design
Get Files
KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
Generate library

Login required · CAD models billed separately as an add-on

Alternative components

3
PartDetailsMatch
B18B-PHDSS-B(LF)(SN)Manufacturer

Has caveats

Has caveats

Design and risk insights

Questions & answers

It is a 2.00mm pitch, 18-position (2x9) dual-row vertical wafer header connector used for wire-to-board connections.