AC7003D4 Datasheet, Specs, Alternatives & ECAD | Zhuhai Jieli Technology Co.,LTD | PartGenie

AI summary

AC7003D4 product

The AC7003D4/D8 is a specialized Bluetooth 5.3 SoC optimized for TWS earphone applications, featuring a 160MHz DSP and integrated audio codec.

Best for

TWS Earphones
Bluetooth Audio Devices

Avoid if

General purpose MCU applications without audio requirements

Check before use

Firmware SDK availability
Pin mapping for specific audio interfaces

Key specifications

Processor: 32-bit Dual-Issue DSP
Bluetooth: V5.3+BR+EDR+BLE
DAC SNR: 102 dB

Compliance & Environment

RoHS: -
REACH: -
MSL: -
ECCN: -
HTSUS: -

Application

Bluetooth TWS Earphones

Datasheet

fbe1b30251e877f606f10cdafb701074_2405301529_JieLi-Tech-AC7003D4_C22440780.pdf

800 KB

CAD Models

Download ECAD models for AC7003D4: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol

Schematic symbol for your EDA tool

PCB Footprint

Land pattern for PCB layout

3D Model

STEP file for mechanical design

KiCad Library

Verified KiCad 8 symbol, footprint, and 3D model

Generate library

Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a 32-bit Dual-Issue DSP Bluetooth 5.3 SoC designed by Zhuhai Jieli Technology, primarily for TWS earphone applications.