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AHW2012C-1R8JTF AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

AHW2012C-1R8JTF product

AHW2012C-1R8JTF

Chokes

InductorWire-Wound0805High-Frequency

The AHW2012C-1R8JTF is a high-frequency wire-wound ceramic chip inductor in an 0805 package, designed for telecommunications and mobile applications.

Best for

  • Bluetooth
  • W-LAN
  • Mobile communication circuits

Avoid if

  • High-power applications exceeding 600mA

Check before use

  • Operating temperature range and soldering profile

Key specifications

Inductance
1.8nH
Tolerance
±5%
Rated Current
600mA
DCR
0.200Ω

Compliance & Environment

RoHS
Compliant
REACH
Compliant
MSL
-
ECCN
-
HTSUS
-

Application

ConnectivityConsumer Electronics

Datasheet

594094deb5fff8a46fabe32c606ba149_2306211549_APV-AHW2012C-1R8JTF_C6808031.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for AHW2012C-1R8JTF: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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Where to Buy

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Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a wire-wound chip ceramic inductor from APV, featuring an inductance of 1.8nH and an 0805 package size.