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BH200V-30P AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

BH200V-30P product

BH200V-30P

Interconnects

2.0mm PitchShrouded HeaderDIP

The XFCN BH200V-30P is a 2.0mm pitch, 30-position (2x15) dual-row shrouded header designed for vertical through-hole PCB mounting.

Best for

  • Board-to-board connectivity
  • Industrial control systems

Avoid if

  • High-vibration environments without additional strain relief

Check before use

  • Mating connector series compatibility

Key specifications

Pitch
2.0 mm
Positions
30 (2x15)
Current Rating
2 A
Mounting
DIP 180°

Compliance & Environment

RoHS
Compliant
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

IndustrialConnectivity

CAD Models

Download ECAD models for BH200V-30P: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a 2.0mm pitch, 30-pin (2x15) dual-row shrouded header (box header) connector designed for vertical through-hole mounting.