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BHI360 AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

BHI360 product

BHI360

Motion Sensors - Accelerometers

IMUlow powersensor fusionprogrammable sensorLGA

BHI360 is a programmable low-power 6-axis IMU combining accelerometer, gyroscope, Fuser2 processing and integrated sensor-fusion software in a 20-pad LGA package.

Best for

  • Low-power motion sensing
  • Wearable and always-on sensor processing

Avoid if

  • A device must operate without host-loaded firmware

Check before use

  • Firmware compatibility and secure-boot requirements
  • Host bus mode, interrupt configuration and PCB footprint

Key specifications

Sensor type
6-axis IMU
Package
20-pad LGA, 3.0 mm × 2.5 mm
Host interface
SPI or I2C
Operating temperature
-40 to 85 °C

Compliance & Environment

RoHS
compliant
REACH
-
MSL
JEDEC Level 1
ECCN
-
HTSUS
-

Application

Wearable motion sensingAlways-on activity detection

Datasheet

36dd95ea86d11ce725754f03e6af4809_BHI360.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for BHI360: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

BHI360 is a programmable smart sensor system containing a 16-bit 3-axis accelerometer, a 16-bit 3-axis gyroscope, a programmable Fuser2 MCU, an ultra-low-power custom core and integrated sensor-fusion software.