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C3030F-GP-A AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

C3030F-GP-A product

C3030F-GP-A

Interconnects

Crimp Terminal3.00mm PitchCJT

The CJT C3030F-GP-A is a 3.00mm pitch crimp terminal designed for use with C3030 series wire-to-board and wire-to-wire connector housings.

Best for

  • Wire-to-board connections
  • Wire-to-wire connections

Avoid if

  • Wire gauge is outside AWG 20-24 range
  • Insulation diameter exceeds 1.85mm

Check before use

  • Crimping tool compatibility

Key specifications

Pitch
3.00 mm
Wire Range
AWG 20-24
Plating
Gold-flash

Compliance & Environment

RoHS
Compliant
REACH
Compliant
MSL
-
ECCN
-
HTSUS
-

Application

General Interconnect

Datasheet

b1265d6c6db97ce85056ca4e4c9c675b_2304140030_CJT-Changjiang-Connectors-C3030F-GP-A_C882169.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for C3030F-GP-A: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a crimp terminal from CJT's C3030 series, featuring a 3.00mm pitch and gold-flash plating.