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C7563X7S1H226MT009S AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

C7563X7S1H226MT009S product

C7563X7S1H226MT009S

Ceramic Capacitors

MLCCSoft Termination22uF50V

The TDK C7563X7S1H226MT009S is a 22µF 50V X7S MLCC with soft termination, designed for high-reliability applications requiring resistance to board bending and thermal stress.

Best for

  • Battery lines
  • Applications prone to board bending
  • Thermal shock environments

Avoid if

  • Space-constrained designs requiring smaller footprints

Check before use

  • PCB layout for 3025 package size

Key specifications

Capacitance
22 µF
Voltage
50 V
Package
3025 (7563)
Temp. Char.
X7S

Compliance & Environment

RoHS
RoHS Compliant
REACH
REACH SVHC-Free
MSL
-
ECCN
-
HTSUS
-

Application

IndustrialGeneral

Datasheet

90e40dd656a2a6b5264b7a14197f8746.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for C7563X7S1H226MT009S: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Where to Buy

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Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a commercial-grade multilayer ceramic chip capacitor (MLCC) from TDK, featuring soft termination for enhanced mechanical endurance.