Ccu-27-X1 Datasheet, Specs, Alternatives & ECAD | Shenzhen Yezhan Electronics Co., Ltd. | PartGenie

AI summary

Ccu-27-X1 product

The Ccu-27-X1 is a tinned copper overcurrent plate designed for high-current surface mount applications, offering excellent thermal conductivity and solderability.

Best for

High current power distribution
Thermal management

Avoid if

Low current signal applications

Check before use

PCB thermal dissipation capacity

Key specifications

Current Rating: 250 A
Dimensions: 27 x 5 x 1 mm
Operating Temp: -65°C to 170°C

Compliance & Environment

RoHS: Compliant
REACH: Compliant
MSL: -
ECCN: -
HTSUS: -

Application

PowerIndustrial

Datasheet

5884ef66ecb9173606deeda4edd2e012_datasheet.pdf

800 KB

CAD Models

Download ECAD models for Ccu-27-X1: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol

Schematic symbol for your EDA tool

PCB Footprint

Land pattern for PCB layout

3D Model

STEP file for mechanical design

KiCad Library

Verified KiCad 8 symbol, footprint, and 3D model

Generate library

Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a tinned copper overcurrent plate from the Ccu series, specifically designed for high-current applications up to 250A.