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CKG57NX7R2A106M500JH AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

CKG57NX7R2A106M500JH product

CKG57NX7R2A106M500JH

Ceramic Capacitors

MLCCMEGACAPStacked10uF100V

The TDK CKG57NX7R2A106M500JH is a 10µF, 100V X7R stacked MLCC designed for high-reliability applications requiring mechanical stress resistance.

Best for

  • Smoothing
  • Decoupling
  • High-reliability circuits

Avoid if

  • Space-constrained designs where standard MLCCs suffice

Check before use

  • PCB footprint compatibility with metal frame terminals

Key specifications

Capacitance
10 µF
Voltage
100 V
Tolerance
±20%
Temp. Char.
X7R

Compliance & Environment

RoHS
ROHS3 Compliant
REACH
Yes
MSL
-
ECCN
-
HTSUS
-

Application

SmoothingDecoupling

Datasheet

CKG57NX7R2A106M500JH-TDK-datasheet-12518290.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for CKG57NX7R2A106M500JH: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Where to Buy

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Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a stacked-type MEGACAP multilayer ceramic chip capacitor (MLCC) from TDK, featuring metal frames for enhanced mechanical and thermal stress resistance.