CKG57NX7R2J474MT009W Datasheet, Specs, Alternatives & ECAD | TDK Electronics AG | PartGenie

AI summary

CKG57NX7R2J474MT009W product

The CKG57NX7R2J474MT009W is a 470nF 630V X7R stacked MLCC with a metal lead frame, designed for high-reliability applications requiring resistance to mechanical and thermal stress.

Best for

DC-DC converters
Smoothing circuits
High-reliability industrial applications

Avoid if

Space-constrained designs where standard MLCCs are sufficient

Check before use

Voltage derating requirements
Mechanical clearance for lead frame

Key specifications

Capacitance: 470 nF
Voltage: 630 V
Tolerance: ±20%
Temp. Characteristic: X7R

Compliance & Environment

RoHS: RoHS Compliant
REACH: REACH SVHC-Free
MSL: -
ECCN: -
HTSUS: -

Application

Power ElectronicsIndustrial

Datasheet

ebb0471c775a80fa39535cbeaf0eb64c.pdf

800 KB

CAD Models

Download ECAD models for CKG57NX7R2J474MT009W: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol

Schematic symbol for your EDA tool

PCB Footprint

Land pattern for PCB layout

3D Model

STEP file for mechanical design

KiCad Library

Verified KiCad 8 symbol, footprint, and 3D model

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Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a stacked multilayer ceramic chip capacitor (MLCC) from TDK, featuring a metal lead frame for enhanced mechanical and thermal shock resistance.