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DF13-8S-1.25C AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

DF13-8S-1.25C product

DF13-8S-1.25C

Interconnects

1.25mm PitchHirose DF13Wire-to-Board

The DF13-8S-1.25C is an 8-position, 1.25mm pitch crimping socket housing from Hirose, designed for compact wire-to-board connections.

Best for

  • Miniature consumer electronics
  • Compact PCB assemblies

Avoid if

  • High-current applications exceeding 1A

Check before use

  • Wire gauge compatibility with crimp contacts

Key specifications

Pitch
1.25 mm
Positions
8
Termination
Crimp

Compliance & Environment

RoHS
Yes
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

Consumer ElectronicsMobile Terminals

Datasheet

DF13-8S-1.25C-Hirose-datasheet-2725.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for DF13-8S-1.25C: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Where to Buy

Real-time and catalog pricing from verified distributors

Live prices updated on demand · Catalog (~) prices may differ

Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a miniature 8-position crimping socket housing with a 1.25mm pitch, part of the Hirose DF13 series.