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DF13G-2630SCFA AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

DF13G-2630SCFA product

DF13G-2630SCFA

Terminals - Wire to Board Connectors

Crimp Contact1.25mm PitchHirose DF13

The DF13G-2630SCFA is a gold-plated crimp contact for Hirose's 1.25mm pitch DF13 series connectors, designed for 26-30 AWG wire.

Best for

  • Miniature wire-to-board connections
  • High-reliability consumer electronics

Avoid if

  • Using non-standard wire gauges outside 26-30 AWG
  • Lacking proper Hirose crimping equipment

Check before use

  • Crimp quality standards
  • Housing compatibility

Key specifications

Pitch
1.25 mm
Wire Gauge
26-30 AWG
Plating
Gold

Compliance & Environment

RoHS
Yes
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

Consumer ElectronicsMobile Terminals

Datasheet

c0a65b5ad82aa2b202d05992ac5ae522_document.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for DF13G-2630SCFA: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Where to Buy

Real-time and catalog pricing from verified distributors

Live prices updated on demand · Catalog (~) prices may differ

Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a crimp contact designed for the Hirose DF13 series 1.25mm pitch wire-to-board connector system, featuring gold plating for enhanced durability.