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DF50S-30DS-1C AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

DF50S-30DS-1C product

DF50S-30DS-1C

Interconnects

1mm PitchHirose DF50Crimp Socket

The DF50S-30DS-1C is a 30-position, 1mm pitch double-row crimp socket housing from Hirose, designed for secure wire-to-board connections.

Best for

  • Wire-to-board applications
  • Compact electronic assemblies

Avoid if

  • High-power applications exceeding 1A

Check before use

  • Crimp contact compatibility
  • Wire gauge requirements

Key specifications

Pitch
1 mm
Positions
30
Rows
2

Compliance & Environment

RoHS
Compliant
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

IndustrialConsumer

Datasheet

3556197ccd35a04641d3d3b00258a346_DF50_Series.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for DF50S-30DS-1C: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Where to Buy

Real-time and catalog pricing from verified distributors

Live prices updated on demand · Catalog (~) prices may differ

Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a 30-position (2x15) double-row crimp socket housing with a 1mm pitch, part of the Hirose DF50 series.