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DF61Y-2S-2.2C(13) AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

DF61Y-2S-2.2C(13) product

DF61Y-2S-2.2C(13)

Interconnects

Wire-to-BoardPower ConnectorHirose

The DF61Y-2S-2.2C(13) is a 2-position crimp socket housing from Hirose's DF61Y series, optimized for secure wire-to-board power connections.

Best for

  • Power supply connections
  • Space-constrained PCB designs

Avoid if

  • Applications requiring non-crimp termination

Check before use

  • Ensure proper crimp contact selection and assembly tools

Key specifications

Positions
2
Pitch
2.2 mm
Temp Range
-40 to +105°C

Compliance & Environment

RoHS
Compliant
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

Power SupplyIndustrial

Datasheet

12d27dadf5ab35d2d2ec677544fc82da_HRS(广濑)&DF61Y-2S-2.2C(13).pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for DF61Y-2S-2.2C(13): KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Where to Buy

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Live prices updated on demand · Catalog (~) prices may differ

Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a 2-position crimp socket housing for the DF61Y series wire-to-board connector system, featuring a 2.2mm pitch and a proprietary ViSe locking mechanism.