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DF63-1S-3.96C AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

DF63-1S-3.96C product

DF63-1S-3.96C

Headers

ConnectorWire-to-BoardHirose

The DF63-1S-3.96C is a 1-position wire-to-board connector housing from Hirose, featuring a 3.96 mm pitch.

Best for

  • Wire-to-board connectivity

Avoid if

  • High-density applications requiring smaller pitch

Check before use

  • Mating header compatibility

Key specifications

Pitch
3.96 mm
Positions
1
Series
DF63

Compliance & Environment

RoHS
Compliant
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

IndustrialConsumer

Datasheet

4db95f0e10c8d0e45118a2de3390c0a1_DF63.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for DF63-1S-3.96C: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Where to Buy

Real-time and catalog pricing from verified distributors

Live prices updated on demand · Catalog (~) prices may differ

Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a single-position connector housing for wire-to-board applications, part of the Hirose DF63 series.