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DS1009-14AT1NX-0A2 AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

DS1009-14AT1NX-0A2 product

DS1009-14AT1NX-0A2

Interconnects

IC SocketDIP2.54mm Pitch

The CONNFLY DS1009-14AT1NX-0A2 is a 14-pin DIP IC socket with a 2.54mm pitch and 7.62mm row spacing, suitable for standard through-hole PCB mounting.

Best for

  • DIP component prototyping
  • Socketing ICs for easy replacement

Avoid if

  • High-vibration environments without additional retention
  • Applications requiring gold-plated contacts

Check before use

  • PCB footprint compatibility
  • Row spacing requirements

Key specifications

Positions
14
Pitch
2.54mm
Row Spacing
7.62mm

Compliance & Environment

RoHS
Compliant
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

IndustrialConsumer

Datasheet

eedc56f6a7d295e5cb76cc2e1d42cbfb_2406241042_CONNFLY-Elec-DS1009-14AT1NX-0A2_C72114.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for DS1009-14AT1NX-0A2: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a 14-position IC socket designed for DIP components with a 2.54mm pitch.