DS1136-06-830SNV Datasheet, Specs, Alternatives & ECAD | CONNFLY | PartGenie

AI summary

DS1136-06-830SNV product

The DS1136-06-830SNV is an 830-point solderless breadboard with a 2.54mm pitch, ideal for rapid prototyping of circuits using through-hole components.

Best for

Prototyping
Educational projects
Breadboard-based circuit testing

Avoid if

High-frequency RF circuits
High-current power distribution
Permanent installations

Check before use

Ensure component leads are within the standard diameter range for breadboard contacts.

Key specifications

Positions: 830
Pitch: 2.54 mm
Operating Temp: -20°C to +80°C

Compliance & Environment

RoHS: Compliant
REACH: -
MSL: -
ECCN: -
HTSUS: -

Application

Prototyping

Datasheet

f136bf2d2df15a5727d36c5424caf6c8_1810161220_CONNFLY-Elec-DS1136-06-830SNV_C93726.pdf

800 KB

CAD Models

Download ECAD models for DS1136-06-830SNV: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol

Schematic symbol for your EDA tool

PCB Footprint

Land pattern for PCB layout

3D Model

STEP file for mechanical design

KiCad Library

Verified KiCad 8 symbol, footprint, and 3D model

Generate library

Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is an 830-position solderless breadboard designed for electronic prototyping, featuring a standard 2.54mm pitch.