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FI-XC3B-1-15000 AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

FI-XC3B-1-15000 product

FI-XC3B-1-15000

Interconnects

Crimp ContactJAE30-36 AWG

The FI-XC3B-1-15000 is a gold-plated crimp blade contact for 30-36 AWG wires, manufactured by JAE Electronics.

Best for

  • Fine-pitch wire-to-board connections

Avoid if

  • Using non-JAE applicators

Check before use

  • Insulation diameter compatibility

Key specifications

Wire Gauge
30-36 AWG
Plating
Gold
Insulation Range
0.45-0.75 mm

Compliance & Environment

RoHS
RoHS Compliant
REACH
-
MSL
Not Applicable
ECCN
EAR99
HTSUS
8536.90.4000

Application

Industrial Connectivity

Datasheet

79188e799b100c70fe42df13501eacd1_2404030920_JAE-Electronics-FI-XC3B-1-15000_C3264956.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for FI-XC3B-1-15000: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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Where to Buy

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Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a crimp-style blade contact designed for high-precision connectivity in 30-36 AWG wire applications.