G11-01-05 AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

G11-01-05 product

G11-01-05

Component

heat sinkaluminum profile6063-T5adhesive backing20 mm × 20 mm

G11-01-05 is a finned 6063-T5 aluminum heat-sink profile with a nominal 20 mm × 20 mm cross-section and adhesive backing.

Best for

  • Compact passive cooling where a small finned aluminum profile with adhesive mounting is suitable

Avoid if

  • A validated thermal resistance value is required
  • Exact finish, adhesive chemistry, or cut length must be controlled from the drawing alone

Check before use

  • Confirm cut length
  • Confirm adhesive temperature and bond requirements
  • Validate thermal performance in the end assembly

Key specifications

Material
6063-T5 aluminum alloy
Profile cross-section
20 mm × 20 mm nominal
Mounting
Adhesive backing

Compliance & Environment

RoHS
-
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

Passive electronic coolingCompact thermal management

CAD Models

Download ECAD models for G11-01-05: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

G11-01-05 is a finned aluminum heat-sink extrusion/profile. Its drawing specifies 6063-T5 aluminum alloy and a nominal 20 mm × 20 mm profile cross-section.