G11-02-03 Datasheet, Specs, Alternatives & ECAD | Ningbo Songle Relay Co., Ltd. | PartGenie

AI summary

G11-02-03 product

The G11-02-03 is a 30x30x10mm black anodized aluminum heatsink featuring a slotted fin design and pre-applied adhesive backing for thermal management.

Best for

General electronics cooling
PCB component thermal management

Avoid if

High-power applications requiring active cooling or larger surface areas

Check before use

Surface cleanliness for adhesive bonding

Key specifications

Dimensions: 30 x 30 x 10 mm
Material: 6063-T5 Aluminum
Mounting: Adhesive

Compliance & Environment

RoHS: -
REACH: -
MSL: -
ECCN: -
HTSUS: -

Application

IndustrialConsumer

Datasheet

bd010be424892597f5b3d96a0ba5db8f_2312081425_wenhaoyongshun-G11-02-03_C5250880.pdf

800 KB

CAD Models

Download ECAD models for G11-02-03: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol

Schematic symbol for your EDA tool

PCB Footprint

Land pattern for PCB layout

3D Model

STEP file for mechanical design

KiCad Library

Verified KiCad 8 symbol, footprint, and 3D model

Generate library

Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a compact, black anodized aluminum heatsink designed for cooling electronic components.