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H2541FV-C762-2x09P AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

H2541FV-C762-2x09P product

H2541FV-C762-2x09P

Interconnects

DIP Socket18-Pin2.54mm Pitch

The H2541FV-C762-2x09P is an 18-pin DIP IC socket with a 2.54mm pitch, designed for reliable through-hole mounting in consumer electronics.

Best for

  • DIP IC mounting
  • Prototyping
  • Consumer electronics

Avoid if

  • High-vibration environments without additional support
  • Applications requiring extreme thermal cycling

Check before use

  • PCB footprint compatibility
  • Soldering profile

Key specifications

Pins
18
Pitch
2.54 mm
Current Rating
1 A

Compliance & Environment

RoHS
Compliant
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

Consumer ElectronicsPrototyping

Datasheet

a1562bd3d7be32e30e4cd96ae7351088_2405141421_HanElectricity-H2541FV-C762-2x09P_C22387109.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for H2541FV-C762-2x09P: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is an 18-pin DIP (Dual In-line Package) IC socket manufactured by HanElectricity, featuring a 2.54mm pin pitch.