HDGC2008H-8P Datasheet, Specs, Alternatives & ECAD | Shenzhen Huade Co-create Technology Co., Ltd. | PartGenie

AI summary

HDGC2008H-8P product

The HDGC2008H-8P is a 2.0mm pitch, 8-position single-row connector housing designed for wire-to-board applications, featuring a built-in locking mechanism for secure connections.

Best for

Wire-to-board connections
Industrial control systems
Consumer electronics

Avoid if

High-vibration environments without proper strain relief
Applications requiring non-standard pitch

Check before use

Mating terminal compatibility
PCB header footprint

Key specifications

Pitch: 2.00 mm
Pin Count: 8
Material: PA66 UL94-V0

Compliance & Environment

RoHS: Compliant
REACH: -
MSL: -
ECCN: -
HTSUS: -

Application

IndustrialConsumer

Datasheet

bb7d7f5e5306c9c0e357cbfabdcfefd6_2112011030_HDGC-HDGC2008H-8P_C2911710.pdf

800 KB

CAD Models

Download ECAD models for HDGC2008H-8P: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol

Schematic symbol for your EDA tool

PCB Footprint

Land pattern for PCB layout

3D Model

STEP file for mechanical design

KiCad Library

Verified KiCad 8 symbol, footprint, and 3D model

Generate library

Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a 2.0mm pitch, 8-pin connector housing from Shenzhen Huade Co-create Technology, typically used in wire-to-board interconnect systems.