HDGC2012WR-S-9P Datasheet, Specs, Alternatives & ECAD | Shenzhen Huade Co-create Technology Co., Ltd. | PartGenie

AI summary

HDGC2012WR-S-9P product

The HDGC2012WR-S-9P is a 9-pin, 2.00mm pitch horizontal SMD header designed for wire-to-board applications, featuring a durable PA6T UL94V-0 housing and tin-plated brass contacts.

Best for

Compact wire-to-board connections
Surface-mount PCB assemblies

Avoid if

High-vibration environments requiring through-hole retention
Applications exceeding 3.0A current

Check before use

PCB footprint compatibility
Reflow soldering profile for PA6T material

Key specifications

Pitch: 2.00 mm
Positions: 9
Mounting: SMD
Current Rating: 3.0 A

Compliance & Environment

RoHS: Compliant
REACH: -
MSL: -
ECCN: -
HTSUS: -

Application

Consumer ElectronicsIndustrial Control

Datasheet

f3c9b1bf0dc07a048ed2d4acd7a54843_2210121700_HDGC-HDGC2012WR-S-9P_C5197126.pdf

800 KB

CAD Models

Download ECAD models for HDGC2012WR-S-9P: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol

Schematic symbol for your EDA tool

PCB Footprint

Land pattern for PCB layout

3D Model

STEP file for mechanical design

KiCad Library

Verified KiCad 8 symbol, footprint, and 3D model

Generate library

Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a 9-position, 2.00mm pitch horizontal surface-mount (SMD) wire-to-board connector header from the PA series, manufactured by HDGC.