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HDGC2013-T AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

HDGC2013-T product

HDGC2013-T

Terminals

Crimp TerminalConnector ContactTin Plated

The HDGC2013-T is a tin-plated crimp terminal designed for secure wire-to-board connections, featuring a nickel underplate for enhanced durability.

Best for

  • Wire-to-board connectivity
  • Consumer electronics
  • Industrial control systems

Avoid if

  • High-vibration environments without proper strain relief
  • Applications requiring gold-plated contacts

Check before use

  • Compatible housing series
  • Wire gauge compatibility

Key specifications

Plating
Tin over Nickel
Terminal Type
Crimp
RoHS
Compliant

Compliance & Environment

RoHS
Compliant
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

IndustrialConsumer Electronics

Datasheet

a191972a3cda990f622372733d47741d_2112011030_HDGC-HDGC2013-T_C2911729.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for HDGC2013-T: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

The HDGC2013-T is a crimp-style electrical terminal contact manufactured by Shenzhen Huade Co-create Technology, typically used in wire-to-board connector assemblies.