HDGC2523WR-S-3P Datasheet, Specs, Alternatives & ECAD | Shenzhen Huade Co-create Technology Co., Ltd. | PartGenie

AI summary

HDGC2523WR-S-3P product

The HDGC2523WR-S-3P is a 3-pin, 2.5mm pitch horizontal SMD wire-to-board header designed for reliable signal and power connections in industrial and consumer electronics.

Best for

Wire-to-board connections
Compact PCB designs
General industrial control

Avoid if

High-vibration environments without strain relief
Applications requiring high-temperature operation above 85°C

Check before use

PCB pad dimensions
Mating housing compatibility

Key specifications

Pitch: 2.5 mm
Current Rating: 3.0 A
Voltage Rating: 250 V

Compliance & Environment

RoHS: Compliant
REACH: -
MSL: -
ECCN: -
HTSUS: -

Application

Industrial ControlConsumer Electronics

Datasheet

217666bc6baa7c58eafde61c95fcfd27_2210121730_HDGC-HDGC2523WR-S-3P_C5197164.pdf

800 KB

CAD Models

Download ECAD models for HDGC2523WR-S-3P: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol

Schematic symbol for your EDA tool

PCB Footprint

Land pattern for PCB layout

3D Model

STEP file for mechanical design

KiCad Library

Verified KiCad 8 symbol, footprint, and 3D model

Generate library

Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a 3-position, 2.5mm pitch horizontal surface-mount (SMD) wire-to-board connector header from Shenzhen Huade Co-create Technology.