HDGC2523WV-S-3P-F Datasheet, Specs, Alternatives & ECAD | Shenzhen Huade Co-create Technology Co., Ltd. | PartGenie

AI summary

HDGC2523WV-S-3P-F product

The HDGC2523WV-S-3P-F is a 3-pin, 2.5mm pitch SMD wire-to-board header connector designed for industrial and consumer electronics applications.

Best for

Wire-to-board connections in compact electronic assemblies.

Avoid if

Applications requiring high-vibration resistance without additional strain relief.

Check before use

Verify the PCB footprint and solder pad dimensions.

Key specifications

Pitch: 2.5 mm
Positions: 3
Current Rating: 3 A
Voltage Rating: 250 V AC/DC

Compliance & Environment

RoHS: Compliant
REACH: -
MSL: -
ECCN: -
HTSUS: -

Application

Consumer ElectronicsIndustrial Control

Datasheet

29a402617bf64a972bbe1f57168c9fd0_2210131730_HDGC-HDGC2523WV-S-3P-F_C5197169.pdf

800 KB

CAD Models

Download ECAD models for HDGC2523WV-S-3P-F: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol

Schematic symbol for your EDA tool

PCB Footprint

Land pattern for PCB layout

3D Model

STEP file for mechanical design

KiCad Library

Verified KiCad 8 symbol, footprint, and 3D model

Generate library

Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a 3-position, 2.5mm pitch surface-mount (SMD) header connector from the XA series, typically used for wire-to-board connections.