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HHM1589E1 AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

HHM1589E1 product

HHM1589E1

Balun

BalunRFTDK0805

The TDK HHM1589E1 is a multilayer balun for 350-470MHz RF applications, featuring 50Ω/200Ω impedance matching in an 0805 package.

Best for

  • RF impedance matching
  • Signal conversion

Avoid if

  • New designs (NRND status)

Check before use

  • Availability and manufacturer status

Key specifications

Frequency
350-470 MHz
Impedance
50Ω / 200Ω
Max Insertion Loss
1.5 dB

Compliance & Environment

RoHS
ROHS3 Compliant
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

RF Connectivity

Datasheet

11128.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for HHM1589E1: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Where to Buy

Real-time and catalog pricing from verified distributors

Live prices updated on demand · Catalog (~) prices may differ

Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a multilayer balun component from TDK designed for RF signal conversion in the 350-470MHz frequency band.