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HHM1727D1 AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

HHM1727D1 product

HHM1727D1

RF/IF and RFID

BalunRF ComponentTDK

The HHM1727D1 is a compact multilayer balun from TDK, optimized for 3300–4200MHz RF applications.

Best for

  • RF signal processing
  • Wireless communication modules

Avoid if

  • Applications outside the 3300–4200MHz range

Check before use

  • PCB layout and land pattern compatibility

Key specifications

Frequency Range
3300–4200 MHz
Insertion Loss
0.78 dB (typ)
Impedance
50 Ω
Package
1.6x0.8 mm

Compliance & Environment

RoHS
ROHS3 Compliant
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

Connectivity

Datasheet

11130.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for HHM1727D1: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Where to Buy

Real-time and catalog pricing from verified distributors

Live prices updated on demand · Catalog (~) prices may differ

Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a multilayer balun component used for impedance matching and signal conversion in RF circuits operating between 3300MHz and 4200MHz.