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HSP-20 AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

HSP-20 product

HSP-20

Interconnects

Cable MountAdhesive

The HIWA HSP-20 is a 20mm x 20mm adhesive-backed cable tie mount made of Nylon 6.6, suitable for organizing wires in various industrial and consumer applications.

Best for

  • Cable routing
  • Wire organization

Avoid if

  • High-vibration environments without additional mechanical fastening
  • Surfaces with poor adhesion properties

Check before use

  • Surface compatibility with the foam adhesive

Key specifications

Material
Nylon 6.6
Dimensions
20mm x 20mm x 6.1mm
Mounting
Adhesive

Compliance & Environment

RoHS
-
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

General

Datasheet

601e2fe1f204174571bb5f1c560a9162_1810312111_HIWA-HSP-20_C155830.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for HSP-20: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

The HSP-20 is a square, self-adhesive cable tie mount manufactured by HIWA, designed to hold cable ties for wire management.