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HSP-25 AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

HSP-25 product

HSP-25

Wires - Management

Cable MountAdhesive BackedNylon 6.6

The HIWA HSP-25 is a 25mm x 25mm adhesive-backed cable tie mount made from Nylon 6.6, suitable for organizing cables in various industrial and consumer applications.

Best for

  • Cable management
  • Panel wiring

Avoid if

  • High-temperature environments exceeding material limits
  • Surfaces with poor adhesion properties

Check before use

  • Surface compatibility with the adhesive backing

Key specifications

Material
Nylon 6.6
Dimensions
25 mm x 25 mm x 7.5 mm
Flammability
UL94V-2

Compliance & Environment

RoHS
-
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

General Cable Management

Datasheet

c29c82dfb41ae4fddcb69ded55b7caeb_1810211710_HIWA-HSP-25_C155831.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for HSP-25: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
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Where to Buy

Real-time and catalog pricing from verified distributors

Live prices updated on demand · Catalog (~) prices may differ

Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is an adhesive-backed cable tie mount used to secure cable ties to flat surfaces.