HX-T100[200G]1.0MM Datasheet, Specs, Alternatives & ECAD | MECHANIC | PartGenie

AI summary

HX-T100[200G]1.0MM product

HX-T100[200g]1.0mm is a 200 g roll of 1.0 mm leaded, rosin-core solder wire described for low-melting-point electronics repair.

Best for

Manual electronics repair
Mobile-phone repair
General hand soldering where leaded solder is permitted

Avoid if

Lead-free production is required
The assembly requires a documented alloy or flux specification

Check before use

Alloy composition
Melting temperature range
Flux percentage and classification
RoHS and REACH status

Key specifications

Wire diameter: 1.0 mm
Quantity: 200 g
Solder type: Leaded
Flux core: Rosin core

Compliance & Environment

RoHS: -
REACH: -
MSL: -
ECCN: -
HTSUS: -

Application

Electronics repairMobile-phone repair

Datasheet

0f8e30f5d2ead69d00db9ab0c6e1742c_HX-T100[200g]1.0mm.pdf

800 KB

CAD Models

Download ECAD models for HX-T100[200G]1.0MM: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol

Schematic symbol for your EDA tool

PCB Footprint

Land pattern for PCB layout

3D Model

STEP file for mechanical design

KiCad Library

Verified KiCad 8 symbol, footprint, and 3D model

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Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a 1.0 mm diameter, 200 g solder wire described as leaded, high-purity, low-melting-point, and rosin-core.