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HY-T AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

HY-T product

HY-T

Interconnects

Crimp Terminal2.00mm PitchWire-to-Board

The HY-T is a 2.00mm pitch phosphor bronze crimp terminal designed for wire-to-board connections in DL20005-Y series housings.

Best for

  • Wire-to-board assembly
  • Compact electronic devices

Avoid if

  • Using wire outside AWG #28-26 range
  • Using non-compatible housing series

Check before use

  • Crimping tool compatibility
  • Housing series match

Key specifications

Pitch
2.00 mm
Wire Range
AWG #28-26
Material
Phosphor Bronze

Compliance & Environment

RoHS
-
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

General Connectivity

Datasheet

971b511dcdee990066aeafa04f2e5ab7_2406241052_HCTL-HC-HY-T_C2962332.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for HY-T: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

The HY-T is a 2.00mm pitch crimp terminal made of tin-plated phosphor bronze, used for wire-to-board connector systems.