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HYC13-SIM07-135 AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

HYC13-SIM07-135 product

HYC13-SIM07-135

Interconnects

Micro SIMConnectorSMDPush-Push

The HYC13-SIM07-135 is a 6-pin Micro SIM card connector with a push-push mechanism, suitable for compact SMD applications.

Best for

  • Consumer electronics
  • Communication modules

Avoid if

  • Extreme temperature environments outside -20°C to +60°C

Check before use

  • PCB footprint layout

Key specifications

Card Type
Micro SIM
Height
1.35 mm
Mounting
SMD

Compliance & Environment

RoHS
Compliant
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

Consumer Electronics

Datasheet

0f42744fb041a523359d93d7cc617a87_2006201234_HOAUC-HYC13-SIM07-135_C645511.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for HYC13-SIM07-135: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Where to Buy

Real-time and catalog pricing from verified distributors

Live prices updated on demand · Catalog (~) prices may differ

Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a Micro SIM card connector featuring a push-push (self-bouncing) mechanism, designed for surface mount technology.