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HYC63-SIM07-137 AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

HYC63-SIM07-137 product

HYC63-SIM07-137

Interconnects

Nano SIMPush-PushSMTConnector

The HYC63-SIM07-137 is a 6-pin Nano SIM card connector with a push-push eject mechanism, suitable for SMT assembly in mobile and IoT devices.

Best for

  • Mobile phones
  • IoT connectivity modules
  • Portable communication devices

Avoid if

  • Applications requiring extreme temperature resistance beyond -20°C to +60°C.

Check before use

  • PCB footprint compatibility
  • Mechanical clearance for the push-push eject mechanism

Key specifications

Connector Type
Nano SIM
Mounting
SMT
Mating Cycles
10,000
Operating Temp
-20°C to +60°C

Compliance & Environment

RoHS
-
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

Consumer ElectronicsConnectivity

Datasheet

28fa1eec4427e52c778f1a904969a44f_2006200933_HOAUC-HYC63-SIM07-137_C645507.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for HYC63-SIM07-137: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a Nano SIM card connector manufactured by HOAUC, featuring a push-push eject mechanism and 6 pins for SMT mounting.