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I-DS1069-03-SCW007 AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

I-DS1069-03-SCW007 product

I-DS1069-03-SCW007

Interconnects

ConnectorHousing2.50mm

The I-DS1069-03-SCW007 is a 2.50mm pitch female housing designed for wire-to-board connections, manufactured by CONNFLY.

Best for

  • Wire-to-board signal and power connections

Avoid if

  • High-vibration environments without strain relief

Check before use

  • Mating header compatibility

Key specifications

Pitch
2.50 mm
Material
Nylon 66
Voltage Rating
250 V

Compliance & Environment

RoHS
Compliant
REACH
Compliant
MSL
-
ECCN
-
HTSUS
-

Application

General Electronics

Datasheet

44dfcd4a6365ecb5dd0ca1591884b27b_CONNFLY&I-DS1069-03-SCW007.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for I-DS1069-03-SCW007: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
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Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a female connector housing with a 2.50mm pitch, typically used in wire-to-board electronic assemblies.