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IC254V-12-08P-1370B AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

IC254V-12-08P-1370B product

IC254V-12-08P-1370B

Interconnects

DIP Socket8-Pin2.54mm Pitch

The IC254V-12-08P-1370B is an 8-pin DIP IC socket featuring a 2.54mm pitch and 7.62mm row spacing, suitable for general-purpose industrial applications.

Best for

  • Prototyping DIP-8 integrated circuits
  • Industrial control boards

Avoid if

  • High-vibration environments requiring permanent soldering
  • Applications exceeding 3A current

Check before use

  • Verify row spacing compatibility with your specific IC package.

Key specifications

Positions
8
Pitch
2.54 mm
Row Spacing
7.62 mm
Current Rating
3 A

Compliance & Environment

RoHS
Compliant
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

IndustrialGeneral Electronics

Datasheet

370b43061eb00fdc570a86a1acf1b634_2008121141_XFCN-IC254V-12-08P-1370B_C717034.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for IC254V-12-08P-1370B: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Where to Buy

Real-time and catalog pricing from verified distributors

Live prices updated on demand · Catalog (~) prices may differ

Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is an 8-position DIP IC socket manufactured by XFCN, designed for standard 2.54mm pitch components.